Click here to go to a list of abstracts for these articles.

• Eric Bruls, "Quality and Reliability Impact of Defect Data Analysis", IEEE Transactions on Semiconductor Manufacturing, Vol. 8, No. 2, May 1995, pp 121-129.
• Michele B. Carey and Luis A. Escobar, "Experimental Design for a Class of Accelerated Degradation Tests", Submitted to Technometrics.
• A. Ioselevich, A.A. Kornyshev, and W. Lehnert, "Degradation of Solid Oxide Fuel Cell Anodes Due to Sintering of Metal Particles", Journal of the Electrochemical Society, Vol. 144, No. 9, September 1997, pp. 3010-3019.
• Yiu-Wing Leung, "Optimal Life Testing Schedule for Multiple Types of Integrated Circuits", IEEE Transactions on Semiconductor Manufacturing, Vol. 6, No. 4, November 1993, pp. 318-323.
• Jye-Chyi Lu, Jinho Park, and Qing Yang, "Statistical Inference of a Time-to-Failure Distribution Derived from Linear Degradation Data" Technometrics, Vol. 39, No. 4, November 1997, pp. 391-400.
• Lu, Joseph and William Meeker. "Using Degradation Measures to Estimate a Time-to-Failure Distribution"
• James F. Prosser and Nicholas T. Panousis, "Reliability Modeling of Soldered Interconnections", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 6, December 1992, pp. 1046-1050.
• Werner F. Rieder and Thomas W. Strof, "Reliability of Commercial Relays During Life Tests at Low Electrical Contact Load", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 2, April 1992, pp. 166-170.

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