Topics in Technological Statistics: Design of experiments (DOE)/Process modeling

Design of experiments (DOE)/Process modeling

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Antonio R. Alvarez, Behrooz L. Abdi, Dennis L. Young, Harrison D. Weed, Jim Teplik, and Eric R. Herald, "Application of Statistical Design and Response Surface Methods to Computer-Aided VLSI Device Design", IEEE Transaction on Computer-Aided Design, Vol. 7, No. 2, February 1988, pp. 272-287.
F. Ruth Anderson, Richard Haynes, and Steven C. Pinault, "Barrier Layer Multilayer Ceramic Capacitor Processing: Effects of Termination and Plating Process Parameters", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4, December 1989, pp. 609-612.
Yukio Aoki, Hiroo Masuda, Shozo Shimada, and Shoji Sato, "A New Design-Centering Methodology for VLSI Device Development", IEEE Transaction on Computer-Aided Design, Vol. CAD-6, No. 3, May 1987, pp. 452-460.
Duane S. Boning, Michael B. McIlrath, Paul Penfield, Jr., and Emanuel M. Sachs, "A General Semiconductor Process Modeling Framework", IEEE Transactions on Semiconductor Manufacturing, Vol. 5, No. 4, November 1992, pp. 266-280.
Scott Bushman, Thomas F. Edgar, and Isaac Trachtenberg, "Modeling of Plasma Etch Systems Using Ordinary Least Squares, Recurrent Neural Network, and Projection to Latent Structure Models", Journal of the Electrochemical Society, Vol. 144, No. 4, April 1997, pp. 1379-1389.
Chieh-Yuan Chao and Linda S. Milor, "Performance Modeling Using Additive Regression Splines", IEEE Transactions on Semiconductor Manufacturing, Vol. 8, No. 3, August 1995, pp. 239-251.
Russell Deaton and Hisham Z. Massoud, "Manufacturability of Rapid-Thermal Oxidation of Silicon: Oxide Thickness, Oxide Thickness Variation, and System Dependency", IEEE Transactions on Semiconductor Manufacturing, Vol. 5, No. 4, November 1992, pp. 347-358.
L. Ken Keys, John R. Balmer, and Robert A. Creswell, "Electronic Manufacturing Process Systems Cost Modeling and Simulation Tools", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-10, No. 3, September 1987.
Karson L. Knutson, Stephen A. Campbell, and Floyd Dunn, "Modeling of Three-Dimensional Effects on Temperature Uniformity in Rapid Thermal Processing of Eight Inch Wafers", IEEE Transactions on Semiconductor Manufacturing, Vol. 7, No. 1, February 1994, pp. 68-72.
Lin and Spanos. "Statistical Equipment Modeling for VLSI Manufacturing: an Application for LPCVD."
K.K. Low and Stephen W. Director, "An Efficient Methodology for Building Macromodels of IC Fabrication Processes", IEEE Transactions on Computer-Aided Design, Vol. 8, No. 12, December 1989, pp. 1299-1313.
Jye-Chyi Lu, William C. Holton, Joel S. Fenner, Stewart C. Williams, Ki Wook Kim, Alan H. Hartford, Di Chen, Ksenia Roze, and Michael A. Littlejohn, "A New Device Design Methodology for Manufacturability", IEEE Transactions on Electron Devices: Special Issue on Process Integration and Manufacturability, Vol. 45, No. 3, pp. 634-642, 1998.
Reece, Jack E. "Sequential Experiments to Characterize Processing Equipment û Maximizing Information Content While Restraining Costs."

Optimization

Duane S. Boning and P.K. Mozumder, "DOE/Opt: A System for Design of Experiments, Response Surface Modeling, and Optimization Using Process and Device Simulation", IEEE Transactions on Semiconductor Manufacturing, Vol. 7, No. 2, May 1994, pp. 233-244.
Godfrey J. Gaston and Anthony J. Walton, "The Integration of Simulation and Response Surface Methodology for the Optimization of IC Processes", IEEE Transactions on Semiconductor Manufacturing, Vol. 7, No. 1, February 1994, pp. 22-33.
A.I. Khuri and M. Conlon, "Simultaneous Optimization of Multiple Responses Represented by Polynomial Regression Functions", Technometrics, Vol. 23, No. 4, November 1981, pp. 363-375.
Purnendu K. Mozumder and Lee M. Loewenstein, "Method for Semiconductor Process Optimization Using Functional Representations of Spatial Variations and Selectivity", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 14, No. 3, June 1992, pp. 311-316.
Michael Sheaffer, Lee R. Levine, and Brian Schlain "Optimizing the Wire-Bonding Process for Copper Ball Bonding, Using Classic Experimental Designs", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-10, No. 3, September 1987, pp. 321-326.
David A. Shumate and Douglas C. Montgomery, "Development of a TiW Plasma Etch Process Using a Mixture Experiment and Response Surface Optimization", IEEE Transactions on Semiconductor Manufacturing, Vol. 9, No. 3, August 1996, pp. 22-33.

Modeling Uniformity

Joseph C. Davis, Jacqueline M. Hughes-Oliver, Jye-Chyi Lu, and Ronald Gyurcsik, "Improved Within-Wafer Uniformity Modeling Through the Use of Maximum-Likelihood Estimation of the Mean and Covariance Surfaces", Journal of the Electrochemical Society, Vol. 143, No. 10, October 1996, pp. 3404-3409.
Ruey-Shan Guo and Emanuel Sachs, "Modeling, Optimization and Control of Spatial Uniformity in Manufacturing Processes", IEEE Transactions on Semiconductor Manufacturing, Vol. 6, No. 1, February 1993, pp. 41-57.
Jacqueline M. Hughes-Oliver, Jye-Chyi Lu, Joseph C. Davis, and Ronald S. Gyurcsik, "Achieving Uniformity in a Semiconductor Fabrication Using Spatial Modeling", Journal of the American Statistical Association, Vol. 93, No. 441, March 1998, pp. 36-45.
Sharad Saxena, Purnendu K. Mozumder, and Kelly J. Taylor, "Simultaneous Control of Multiple Measures of Nonuniformity Using Site Models and Monitor Wafer Control", IEEE Transactions on Semiconductor Manufacturing, Vol. 9, No. , February 1996, pp. 128-135.

Multivariate Models

Bhavik R. Bakshi, "Multiscale PCA with Application to Multivariate Statistical Process Monitoring", AIChE Journal, Vol. 44, No. 7, July 1998, pp. 1596-1610.
Chee K. Chow, "Projection of Circuit Performance Distributions by Multivariate Statistics", IEEE Transactions on Semiconductor Manufacturing, Vol. 2, No. 2, May 1989, pp. 60-65.

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